PRODUCTION CAPABILITY OF PCB
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PROCESS Engineer
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ITEMS Item
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PRODUCTION CAPABILITY Manufacturing
Capability
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Laminate
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Type
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FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,
TEFLON
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Thickness
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0.2~3.2mm
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Production Type
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Layer Count
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2L-16L
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Surface Treatment
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HAL,Gold Plating,Immersion Gold,OSP,Immersion
Silver,Immersion Tin,Lead Free HAL
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Cut Lamination
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Max. Working Panel size
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1000×1200mm
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Inner Layer
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Internal Core Thickness
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0.1~2.0mm
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Internal width/spacing
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Min: 4/4mil
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Internal Copper Thickness
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1.0~3.0oz
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Dimension
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Board Thickness Tolerance
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±10%
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Interlayer Alignment
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±3mil
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Drilling
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Manufacture Panel Size
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Max: 650×560mm
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Drilling Diameter
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≧0.25mm
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Hole Diameter Tolerance
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±0.05mm
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Hole Position Tolerance
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±0.076mm
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Min.Annular Ring
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0.05mm
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PTH+Panel Plating
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Hole Wall copper Thickness
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≧20um
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Uniformity
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≧90%
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Outer Layer
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Track Width
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Min: 0.08mm
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Track Spacing
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Min: 0.08mm
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Pattern Plating
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Finished Copper Thickness
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1oz~3oz
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EING/Flash Gold
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Nickel Thickness
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2.5um~5.0um
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Gold Thickness
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0.03~0.05um
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Solder Mask
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Thickness
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15~35um
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Solder Mask Bridge
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3mil
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Legend
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Line width/Line spacing
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6/6mil
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Gold Finger
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Nickel Thickness
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≧120u〞
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Gold Thickness
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1~50u〞
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Hot Air Level
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Tin Thickness
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100~300u〞
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Routing
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Tolerance of Dimension
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±0.1mm
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Slot Size
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Min:0.4mm
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Cutter Diameter
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0.8~2.4mm
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Punching
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Outline Tolerance
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±0.1mm
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Slot Size
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Min:0.5mm
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V-CUT
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V-CUT Dimension
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Min:60mm
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Angle
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15°30°45°
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Remain Thickness Tolerance
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±0.1mm
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Beveling
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Beveling Dimension
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30~300mm
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Test
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Testing Voltage
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250V
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Max.Dimension
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540×400mm
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Impedance Control
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Tolerance
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±10%
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Aspect Ration
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12:1
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Laser Drilling Size
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4mil(0.1mm)
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Special Requirements
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Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable
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OEM&ODM Service
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Yes
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