Shenzhen SYF Precision Electronics limited
5 1

FR4 Double Layer Custom PCB Boards Green Mask Solar Printed Circuit Board

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Shenzhen SYF Precision Electronics limited
[China]

Address
Room801-805,7/Floor,Dehe Building,Shajing Town,Bao'an District,Shenzhen,Guangdong,China beijing beijing
Phone
86-0755-29928869
Contact name
Bryant

Quick Information

  • Brand Name: SYF
  • Place of Origin: China
  • Model Number : SYF-269

Description

FR4 Double Layer Custom PCB Boards Green Mask Solar Printed Circuit Board

Quick Details:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

6-Layer

Board Thickness

1.6mm

Copper Thickness

1.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales 
Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
          PRODUCTION CAPABILITY Manufacturing 

Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,

TEFLON

Thickness

0.2~3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,Immersion 

Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1~2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

 Min.Annular Ring 

0.05mm

PTH+Panel Plating

 Hole Wall copper Thickness

≧20um

 Uniformity

≧90%

 Outer Layer

 Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

1oz~3oz

EING/Flash Gold

 Nickel Thickness

2.5um~5.0um

 Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

 Solder Mask Bridge

3mil

 Legend

 Line width/Line spacing

6/6mil

 Gold Finger

 Nickel Thickness

≧120u〞

 Gold Thickness

1~50u〞

 Hot Air Level

 Tin Thickness

100~300u〞

 Routing

 Tolerance of Dimension

±0.1mm

 Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

 Punching

 Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

 V-CUT Dimension

Min:60mm

 Angle

15°30°45°

 Remain Thickness Tolerance

±0.1mm

Beveling

Beveling Dimension

30~300mm

Test

Testing Voltage

250V

Max.Dimension

540×400mm

Impedance Control

 
    Tolerance
 

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,

 BGA Soldering and Gold Finger Are Acceptable

OEM&ODM Service

Yes


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